Reference materials

Semiconductor manufacturing relies on a wide variety of equipment and facility systems, each requiring highly reliable fluid control. Valves play a critical role in maintaining process performance, safety, and purity throughout these applications. This page introduces the valves used in key semiconductor manufacturing equipment and facilities. Click the links below to learn more about each category.

In semiconductor manufacturing, deposition processes are used to form thin films such as insulating, conductive, and barrier layers on wafers, creating the structures required for semiconductor devices. Technologies including CVD, PVD, ALD, and epitaxy (Epi) are utilized to produce high-quality films with precise control of thickness, composition, and uniformity.

Deposition equipment encompasses a wide range of systems used to form thin films on wafer surfaces. These systems include CVD technologies such as LPCVD and PECVD, which utilize chemical reactions; PVD technologies such as sputtering and evaporation, which rely on physical processes; ALD systems that deposit films one atomic layer at a time; and epitaxy (Epi) and MOCVD systems used for crystalline film growth.

Because film quality directly impacts many subsequent manufacturing processes, deposition is considered one of the most critical stages in semiconductor fabrication, influencing both device performance and production yield. As a result, deposition equipment requires precise process control and highly stable operation over extended periods.

Valves are among the key components that support equipment performance and reliability. Here, we introduce our product lineup for use in a wide variety of deposition equipment and systems.

Deposition processes require precise control and switching of high-purity precursor gases, process gases, and purge gases. In addition, maintaining a clean process environment and stable exhaust performance is essential for achieving consistent film quality and process stability. Therefore, valves and fittings used in deposition equipment must offer the following key characteristics:

Deposition equipment requires high-precision switching and control of precursor gases, process gases, and purge gases while maintaining the highest levels of gas purity. Because thin-film quality is highly sensitive to contamination and residual gases, ultra-high-purity gas valves must provide ultra-low leakage, low dead volume, and fast response characteristics to ensure stable and reliable process performance.

Deposition equipment requires high-purity connections for precursor gases, process gases, and purge gases while maintaining the highest levels of gas purity. Because impurities and trace leaks can adversely affect film quality and create safety risks, ultra-high-purity gas fittings with ultra-low leakage and low outgassing characteristics are required.

In deposition processes that require a vacuum environment, vacuum valves with excellent sealing performance are essential for chamber evacuation, isolation, and pressure control. To achieve uniform thin-film deposition, precise pressure control must be maintained throughout each process while preventing leakage and contamination. For this reason, vacuum valves and pressure control valves with excellent durability, reliable sealing performance, and low particle generation are widely used.

In deposition equipment, the purity and stability of process gases are critical to achieving consistent film quality. To prevent contamination and maintain gas integrity, diaphragm valves for high-purity applications are required to provide high-purity performance, high leak integrity, and excellent corrosion resistance.

Deposition equipment requires high-precision switching and control of precursor gases, process gases, and purge gases while maintaining the highest levels of gas purity. The following valve and unit products are used to ensure reliable gas delivery and stable process performance.

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Cleaning process equipment removes impurities such as photoresist residues, particles, metallic contaminants, and native oxide formed during processes including film deposition, lithography, and etching, ensuring wafer surfaces remain in optimal condition.
Since these contaminants significantly degrade device performance and yield, cleaning is repeatedly performed in the sequence of cleaning → deposition → lithography → etching → cleaning.
Cleaning precision and reproducibility are critical, especially at advanced nodes, where even a single particle can cause defects.

PFA valves used to supply cleaning chemicals are required to provide excellent chemical resistance to acids, alkalis, and solvents, as well as high-purity performance and low metal leaching. In addition to durability under frequent valve operation and stable flow control, a compact, space-saving design is also important to accommodate installation constraints within equipment.

PFA valves are widely used in cleaning process equipment because they provide excellent chemical resistance and low metal ion extractables, enabling reliable handling of the aggressive chemicals used in semiconductor manufacturing.

PFA fittings with excellent chemical resistance and low metal ion extractables are used in cleaning process equipment to maintain chemical purity and prevent leakage throughout the fluid delivery system. Among them, fusion-weld fittings offer a compact design and reduced dead volume, contributing to space savings and stable equipment operation.

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Cylinder cabinets must maintain the purity of high-purity process gases supplied to semiconductor process tools while preventing gas leakage. Even trace amounts of contamination or leakage can adversely affect process performance and create safety risks. Therefore, ultra-high-purity (UHP) gas fittings with ultra-low leakage and low outgassing characteristics are essential to ensure both process integrity and safe operation.

Gas purifier fittings are required to provide high-purity performance, low particle generation, low outgassing characteristics, and excellent corrosion resistance.

Vaporized process gases supplied from liquid delivery systems require precise temperature control to prevent condensation and solidification. Therefore, valves used in these systems must provide excellent heat resistance, high flow capacity, and stable Cv performance to ensure reliable gas delivery and stable process conditions.

Ultra-high-purity gas fittings used in liquid delivery systems are required to have low leakage and high chemical resistance to maintain the chemical stability of liquid precursor materials and vaporized process gases.

Chemical VMBs use PFA fittings with excellent chemical resistance and low metal ion extractables to ensure the stable distribution of high-purity chemical solutions. Fusion-weld PFA fittings provide a leak-tight connection through butt welding of the fitting and tubing, eliminating the need for retightening and minimizing the risk of fluid leakage. In addition, their compact design helps reduce installation space requirements and contributes to efficient equipment layout.

Valves used in gas VMBs are required to provide high leak tightness and high-purity performance to ensure the safe and clean distribution of various process and utility gases to multiple semiconductor process tools. In addition to using materials that can withstand a wide range of gases, including corrosive and reactive gases, these valves must provide ultra-low leakage and reliable switching and shutoff performance to prevent gas misdelivery and backflow.

Furthermore, a low-dead-volume design is essential for minimizing residual gas during gas changeover, helping to maintain gas purity and improve purge efficiency. As a result, valve performance is a key factor in the stable and reliable operation of the entire VMB system.

Gas VMBs use ultra-low-leakage valves to ensure the safe and reliable distribution of high-purity gases. High-purity performance, reliable switching and sealing performance, corrosion resistance, and long-term stability are essential valve requirements.

Gas VMBs use ultra-low-leakage, high-purity fittings to ensure the clean and safe distribution of high-purity gases.

Valves used in abatement systems are required to provide excellent corrosion resistance and chemical resistance to safely and reliably handle high concentrations of corrosive gases and chemicals over extended periods of operation. In addition, because even trace leakage is unacceptable in these applications, superior sealing performance and reliable switching and shutoff performance are essential.

Abatement systems require valves that safely handle and discharge hazardous gases generated by semiconductor process equipment.

Utility piping (primary gas supply) refers to the gas distribution network that supplies bulk gases such as N₂, O₂, and Ar to facility systems, including VMBs, throughout a semiconductor manufacturing plant.

Utility piping (primary gas supply) requires valves that provide a safe and stable supply of high-purity bulk gases throughout the semiconductor manufacturing plant.

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